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                                                                        Capability
Layer1-36LMin.   finished thickness(2L)0.3mm
Max. panel size1500mm*610mm
Min.   finished thickness(multilayer)0.4mm
Max. Cu thickness12OZMax.   finished thickness4.0mm
Min.Cu thickness(base)1/3OZMin.   core thickness0.1mm
Max.Cu thickness(base)5OZDrilling   hole to hole tolerance±0.05mm
Aspect ratio10:1Min.   hole diameter tolerance (PTH)±0.075mm
Etching tolerance±10%Min.   hole diameter tolerance (NPTH)±0.05mm
Min.line with0.075mm(3mil)Min.   routing tolerance±0.10mm
Min.line space0.075mm(3mil)Min.   stamping edge to edge tolerance±0.075mm
Min. hole diameter0.20mmV-cut   edge to edge tolerance±0.10mm(4mil)
Board bow and twist≤   0.75%Registration(O/L)±0.05mm(2mil)
Impedance tolerance±10%Paterning   positioning tolerance±0.075mm(3mil)
Hole copper thickness30umMax.test   points/Board(universal ET)Jig Test Fixture:15000
    Flying Probing:1-∞
Surface finishHAL-LF,HASL,Immersion Gold,Immersion Silever,OSP
Base materialFR-4,   Hi-TG FR-4, Halogern free FR-4、CEM1、CEM3, Aluminum based boards
Standard lead timeMultilayer:9   wds,2L:7wds,sample:3-6wds



Product information
Product name Product picture Product parameters
Base station power amplifier board
羅杰斯多層板
北斗多頻板
Applications: LED

Plate: Aluminum

Number of floors: 1L

Complete thickness: 1.2mm

Finished copper thickness: 1OZ

Surface treatment: HASL

Minimum aperture: 2.05mm


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